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CTP-FOG Automatic Dual-Side ACF Bonding
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CTP-FOG Microscopic & Electrical Inspection
After bonding, panels go through Microscopic Inspection to verify bond alignment and quality, followed by CTP-FOG Electrical Testing to validate touch signal integrity, linearity, and noise immunity.
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CTP-FOG Single-Line Adhesive Dispensing
single-line adhesive dispensing applies protective epoxy to the bonding area, enhancing mechanical strength and moisture resistance. The process ensures uniform coverage without overflow or bubbles.
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Sensor SCA Attachment & SCA Lamination
Structural Conductive Adhesive (SCA) is applied to the touch sensor, followed by SCA Lamination with the LCD/Cover Glass assembly. This creates a rigid, optically clear bond for full-lamination applications.


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SCA Defoaming & UV Curing
The laminated assembly enters a vacuum defoaming stage to eliminate micro-bubbles, then undergoes SCA UV Curing to harden the adhesive, ensuring zero light leakage and long-term bonding stability.

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7F, Bldg 2, Jiancang Technology Park, No.11 Songgang Blvd., Baoan, Shenzhen
