LCD CTP Full Lamination
  • Fully automatic lamination machine - CDTECH
    Full module function test

    Full Lamination Process | OCA/SCA Optical Bonding

    CDTech’s full lamination workflow combines automatic OCA bonding, vacuum defoaming, and UV curing. Our process eliminates air gaps, delivering high optical clarity, touch sensitivity, and impact resistance for industrial-grade display modules.

    Full Lamination Description

    Every full-laminated module undergoes functional testing, bubble inspection, and OQC audit. Our industrial-grade bonding ensures zero light leakage, consistent performance, and long-term durability in harsh environments.

  • CTP & LCM Automatic OCA Bonding

    CTP & LCM Automatic OCA Bonding

    The full lamination process begins with CTP & LCM Automatic OCA Bonding, where the touch panel and LCD module are precisely aligned and bonded using high-quality OCA optical adhesive. This step eliminates air gaps between layers, forming a seamless integrated structure.

  • OCA Defoaming

    OCA Defoaming

    The bonded assembly is placed in a vacuum chamber for OCA Defoaming. Under controlled pressure and temperature, residual micro-bubbles are completely removed, ensuring a uniform, bubble-free bond.

  • Protective Edge Sealing & Conductive Cloth Attachment-cdtech

    Protective Edge Sealing & Conductive Cloth Attachment

    Next, foam tape is applied around the cover glass edge for shock absorption and dust resistance, while conductive cloth is attached to the CTP FPC to enhance EMI shielding and electrical stability.

  • LCM & CTP Functional Testing

    LCM & CTP Functional Testing

    The full module undergoes dual validation:
    • LCM Functional Testing: Verifies display brightness, color uniformity, and interface communication.
    • CTP Functional Testing: Validates touch accuracy, linearity, and multi-touch performance.
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    sales@cdtech-lcd.com

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    7F, Bldg 2, Jiancang Technology Park, No.11 Songgang Blvd., Baoan, Shenzhen